Commit 4403278e4ea2 for kernel

commit 4403278e4ea2f654f8130a5c03eb8b4516a0f201
Merge: df37e3924292 503bb6e70bbf
Author: Linus Torvalds <torvalds@linux-foundation.org>
Date:   Wed Oct 21 14:38:01 2026 -1000

    Merge tag 'thermal-7.4-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm

    Pull thermal control updates from Rafael Wysocki:
     "These are mostly updates of thermal drivers including a new Exynos
      ACPM thermal driver for Google GS101, new Renesas RZ/G3L thermal
      sensor support, new Qualcomm MSM8952 TSENS support, new Qualcomm
      PMAU0102 Master BandGap temperature monitor support in DT bindings,
      and new rugged Panther Lake support in intel_tcc_cooling. Moreover,
      the AN7583 driver is extended to register separate thermal zones for
      bandgap, GbE and CPU (its DT bindings are updated accordingly).

      There are also multiple fixes and assorted cleanups, as usual.

      Specifics:

       - Make the Intel powerclamp thermal driver reject invalid window_size
         values, drop redundant clamp() from duration_set() in it, and
         simplify 4 functions in it (Thorsten Blum)

       - Add rugged Panther Lake support to the intel_tcc_cooling thermal
         driver (Srinivas Pandruvada)

       - Fix temperature selection around 0 C in the int340x thermal driver,
         drop redundant else from proc_thermal_add() in it, and simplify
         slider_def_*_set() in it (Thorsten Blum)

       - Drop unbalanced paren from cpu-idle-cooling.rst (Manuel Ebner)

       - Use %pe to print error pointers symbolically in the thermal control
         code and fix assorted typos in comments in it (Sumeet Pawnikar and
         Hemanth Selam)

       - Add the Exynos ACPM thermal driver for Google GS101, along with DT
         bindings and a MAINTAINERS entry (Tudor Ambarus)

       - Add Renesas RZ/G3L thermal sensor support and DT bindings, and move
         default calibration values to per-SoC match data (Biju Das)

       - Add Qualcomm MSM8952 TSENS support and the corresponding DT binding
         compatible (Muzaffer Kadir)

       - Document the Qualcomm PMAU0102 Master BandGap temperature monitor
         compatible in the DT bindings (Dhruvin Rajpura)

       - Extend the QCom TSENS v2 trip temperature limits to the hardware
         range of -204°C to +204°C to prevent interrupt storms when
         operating beyond the previous software limits (Priyansh Jain)

       - Fix temperature threshold map indexing in the QCom SPMI temperature
         alarm driver to prevent out-of-bounds reads (Georgi Djakov)

       - Describe the additional bus clock required by the Amlogic T7
         thermal sensor and switch the driver to the clk_bulk API to manage
         multiple clocks (Ronald Claveau)

       - Request the Airoha EN7581 IRQ after thermal zone registration to
         prevent the interrupt handler from accessing an unregistered or
         already freed thermal zone (Vitaliy Sochnev)

       - Fix the Airoha AN7583 ADC mux field mapping, serialize access to
         the shared ADC, and verify mux selection to avoid invalid
         temperature readings and spurious critical shutdowns (Vitaliy
         Sochnev)

       - Register separate thermal zones for the AN7583 bandgap, GbE and CPU
         sensors, and update the DT bindings to use one thermal sensor cell
         to select the sensor (Vitaliy Sochnev)

       - Fix signed integer overflow in the Renesas RZ/G3E
         temperature-to-code conversion, preserve compare interrupt state
         across runtime PM, and prevent overlapping temperature conversions
         (Ovidiu Panait)

       - Remove redundant trip window validation and runtime PM
         pm_runtime_mark_last_busy() calls from the Renesas RZ/G3E driver
         (Ovidiu Panait)

       - Propagate reset assertion failures from Renesas RZ/G3E suspend and
         attempt to restore power if the sensor was active (Pengpeng Hou)

       - Stop the TI bandgap alert IRQ before removing sensor interfaces and
         cancel pending alert work to prevent use-after-free on driver
         removal (Weigang He)

       - Validate Spreadtrum sensor IDs read from the device tree before
         using them for register offsets and array indexing (Weigang He)

       - Convert the TI OMAP bandgap DT bindings to schema and document the
         DRA752 compatible and thermal sensor cells (Bhargav Joshi)

       - Use DT property helpers matching the signed temperature and
         unsigned hysteresis types defined by the thermal zone bindings (Rob
         Herring)

       - Reuse common error handling code in the power allocator governor
         bind callback (Markus Elfring)

       - Constify the thermal zone device operations in the i.MX9 driver
         (Christophe JAILLET)

       - Fix kernel-doc parameter names and firmware node references in the
         cooling device registration helpers (Aryan Sinha)

       - Correct the documented return value of ti_bandgap_get_sensor_data()
         to describe validation errors and potentially NULL stored data
         (Karl Mehltretter)

       - Ensure NUL-termination when copying the cooling device command-line
         argument in tmon and fix the associated string truncation warning
         (Florian Fainelli)

       - Fix undefined behavior caused by a signed shift in the tmon thermal
         zone binding display (Liu Jing)

       - Fix wording in tmon comments (Hemanth Selam)

       - Simplify cpufreq_set_cur_state() in the cpufreq_cooling thermal
         control driver (Thorsten Blum)"

    * tag 'thermal-7.4-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm: (51 commits)
      thermal/drivers/rzg3e: Propagate reset assertion failure from suspend
      thermal: ti-soc-thermal: Fix the return value in ti_bandgap_get_sensor_data() kernel-doc
      thermal/fw: Fix kernel-doc parameter names
      thermal/qcom/tsens: Add support for MSM8952 tsens
      dt-bindings: thermal: tsens: Add MSM8952
      thermal/drivers/amlogic: Switch to clk_bulk API to support multiple clocks
      dt-bindings: thermal: amlogic: describe bus clock for t7-thermal
      tools/thermal/tmon: Fix string truncation warning in optarg copy
      thermal/drivers/airoha: Register a thermal zone per AN7583 sensor
      dt-bindings: arm: airoha: Use one thermal sensor cell for AN7583
      thermal/drivers/airoha: Serialise access to the shared ADC
      thermal/drivers/airoha: Fix AN7583 ADC mux field mapping
      thermal/drivers/sprd: validate the sensor id from the device tree
      thermal/drivers/ti-soc-thermal: Cancel pending alert work on remove
      thermal/drivers/qcom-spmi-temp-alarm: Fix temp_map indexing
      thermal: gov_power_allocator: Use common error handling code in power_allocator_bind()
      tools/thermal/tmon: Fix signed shift UB in binding display
      MAINTAINERS: Add entry for Samsung Exynos ACPM thermal driver
      thermal/drivers/samsung: Add Exynos ACPM TMU driver GS101
      dt-bindings: thermal: Add Google GS101 TMU
      ...